Receive 9931-BDLJ NSN Part by Bae Systems Operations Limited Dba Bae Systems Plc with NSN 5962-01-292-9198

Mfg Part Number: 9931-BDLJ Alternate P/N: 9931BDLJ NSN : 5962-01-292-9198
NIIN : 012929198 CAGE Code : K0656 Manufacturer: Bae Systems Operations Limited Dba Bae Systems Plc
Item Name : Microcircuit Memory FSC : 5962 Microcircuits Electronic

ASAP Integrated Distribution is a purchasing platform owned and operated by ASAP Semiconductor, and we are your sourcing solution for 9931-BDLJ Microcircuit Memory NSN parts with NSN 5962-01-292-9198. This 9931-BDLJ NSN product is manufactured by Bae Systems Operations Limited Dba Bae Systems Plc. If you are interested in this item and would like to kickstart the procurement process with a quote for your comparisons, complete and submit the form provided below at your earliest convenience. Once we receive a form, a dedicated account manager will rapidly formulate a customized solution and personally reach out to you within 15 minutes or less.

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To ensure that customers only purchase the exact parts that they require, we list items with all applicable information. For example, NSN 5962-01-292-9198 was specifically produced under the CAGE Code K0656, denoting the specific Bae Systems Operations Limited Dba Bae Systems Plc facility that its production traces back to. Additionally, we conduct extensive document verification, ensuring that our offerings are traceable, up to required standards, and more. With our steadfast dedication to quality control and compliance, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Kickstart the procurement process for the NSN parts you need with an RFQ, and we will do the rest for you!

NSN Information for Part Number 9931-BDLJ with NSN 5962-01-292-9198, 5962012929198

NSNFSCNIINCLSHazmatDEMILCancelled NSN
5962-01-292-9198

Item Description:

Microcircuit Memory

59620129291980NB
CIICHCCESDPMICCriticalityENAC
UBA0
Part NumberISCRNVCRNCCHCCMSDSSADC
9931-Bdlj225

Characteristics Data of NSN 5962-01-292-9198, 5962012929198

MRCCriteriaCharacteristic
MEMORYADAQBODY LENGTH1 060 INCHES MAXIMUM
MEMORYADATBODY WIDTH0 220 INCHES MINIMUM AND 0 310 INCHES MAXIMUM
MEMORYADAUBODY HEIGHT0 140 INCHES MINIMUM AND 0 185 INCHES MAXIMUM
MEMORYAEHXMAXIMUM POWER DISSIPATION RATING2 0 WATTS
MEMORYAFGAOPERATING TEMP RANGE-55 0125 0 DEG CELSIUS
MEMORYAFJQSTORAGE TEMP RANGE-65 0150 0 DEG CELSIUS
MEMORYCBBLFEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC
MEMORYCQSJINCLOSURE MATERIALCERAMIC
MEMORYCQSZINCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORYCQWXOUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
MEMORYCQZPINPUT CIRCUIT PATTERN16 INPUT
MEMORYCTFTCASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
MEMORYCZENVOLTAGE RATING AND TYPE PER CHARACTERISTIC-0 5 VOLTS MINIMUM POWER SOURCE AND 12 0 VOLTS MAXIMUM POWER SOURCE
MEMORYCZEQTIME RATING PER CHACTERISTIC30 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 30 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT
MEMORYCZERMEMORY DEVICE TYPEPAL
MEMORYTESTTEST DATA DOCUMENT96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC
MEMORYTTQYTERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT

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