Mfg Part Number: MMI-5301-1D 883B | Alternate P/N: MMI53011D883B | NSN : 5962-01-363-9445 |
NIIN : 013639445 | CAGE Code : 50364 | Manufacturer: Mmi Amd |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
ASAP Integrated Distribution is a purchasing platform owned and operated by ASAP Semiconductor, and we are your sourcing solution for MMI-5301-1D 883B Microcircuit Memory NSN parts with NSN 5962-01-363-9445. This MMI-5301-1D 883B NSN product is manufactured by Mmi Amd. If you are interested in this item and would like to kickstart the procurement process with a quote for your comparisons, complete and submit the form provided below at your earliest convenience. Once we receive a form, a dedicated account manager will rapidly formulate a customized solution and personally reach out to you within 15 minutes or less.
To ensure that customers only purchase the exact parts that they require, we list items with all applicable information. For example, NSN 5962-01-363-9445 was specifically produced under the CAGE Code 50364, denoting the specific Mmi Amd facility that its production traces back to. Additionally, we conduct extensive document verification, ensuring that our offerings are traceable, up to required standards, and more. With our steadfast dedication to quality control and compliance, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Kickstart the procurement process for the NSN parts you need with an RFQ, and we will do the rest for you!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-363-9445 Item Description: Microcircuit Memory | 5962 | 013639445 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Mmi-5301-1d 883b | 5 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,FUSED MSI MICROCONTROLLER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM INPUT |
CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS NOMINAL ACCESS AND 60.00 NANOSECONDS MAXIMUM ACCESS |
CZER | MEMORY DEVICE TYPE | PROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
ZZZK | SPECIFICATION/STANDARD DATA | 96906-MIL-STD-883/TX/ GOVERNMENT STANDARD |
CBBL | FEATURES PROVIDED | PROGRAMMED |
TEST | TEST DATA DOCUMENT | 49956-996378-324 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING D |
AGAV | END ITEM IDENTIFICATION | DISPLAY CONSO E/I FSCM 49956 |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
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