Mfg Part Number: 0P830WSL | NSN : 5961-01-444-8076 | NIIN : 014448076 |
CAGE Code : 32694 | Manufacturer: Optek Technology Inc | Item Name : Semiconductor Device Photo |
FSC : 5961 Semiconductor Devices and Associated Hardware |
ASAP Integrated Distribution is a purchasing platform owned and operated by ASAP Semiconductor, and we are your sourcing solution for 0P830WSL Semiconductor Device Photo NSN parts with NSN 5961-01-444-8076. This 0P830WSL NSN product is manufactured by Optek Technology Inc. If you are interested in this item and would like to kickstart the procurement process with a quote for your comparisons, complete and submit the form provided below at your earliest convenience. Once we receive a form, a dedicated account manager will rapidly formulate a customized solution and personally reach out to you within 15 minutes or less.
To ensure that customers only purchase the exact parts that they require, we list items with all applicable information. For example, NSN 5961-01-444-8076 was specifically produced under the CAGE Code 32694, denoting the specific Optek Technology Inc facility that its production traces back to. Additionally, we conduct extensive document verification, ensuring that our offerings are traceable, up to required standards, and more. With our steadfast dedication to quality control and compliance, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Kickstart the procurement process for the NSN parts you need with an RFQ, and we will do the rest for you!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-444-8076 Item Description: SEMICONDUCTOR DEVICE,PHOTO | 5961 | 014448076 | N | |||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
0P830WSL | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.187 INCHES MINIMUM AND 0.202 INCHES MAXIMUM" |
AKPV | MOUNTING FACILITY QUANTITY | 1" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18" |
AXGY | MOUNTING METHOD | UNTHREADED HOLE" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN" |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR" |
ABHP | OVERALL LENGTH | 0.187 INCHES MINIMUM AND 0.202 INCHES MAXIMUM" |
AKPV | MOUNTING FACILITY QUANTITY | 1" |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18" |
AXGY | MOUNTING METHOD | UNTHREADED HOLE" |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON" |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN" |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR" |
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