Mfg Part Number: HEF4526BP | NSN : 5962-01-013-8770 | NIIN : 010138770 |
CAGE Code : F6650 | Manufacturer: Philips Composants Sa Div | Item Name : Microcircuit Memory |
FSC : 5962 Microcircuits Electronic |
ASAP Integrated Distribution is a purchasing platform owned and operated by ASAP Semiconductor, and we are your sourcing solution for HEF4526BP Microcircuit Memory NSN parts with NSN 5962-01-013-8770. This HEF4526BP NSN product is manufactured by Philips Composants Sa Div. If you are interested in this item and would like to kickstart the procurement process with a quote for your comparisons, complete and submit the form provided below at your earliest convenience. Once we receive a form, a dedicated account manager will rapidly formulate a customized solution and personally reach out to you within 15 minutes or less.
To ensure that customers only purchase the exact parts that they require, we list items with all applicable information. For example, NSN 5962-01-013-8770 was specifically produced under the CAGE Code F6650, denoting the specific Philips Composants Sa Div facility that its production traces back to. Additionally, we conduct extensive document verification, ensuring that our offerings are traceable, up to required standards, and more. With our steadfast dedication to quality control and compliance, we operate with AS9120B, ISO 9001:2015, and FAA AC 00-56B accreditation. Kickstart the procurement process for the NSN parts you need with an RFQ, and we will do the rest for you!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-013-8770 Item Description: Microcircuit Memory | 5962 | 010138770 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | ||||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Hef4526bp | 3 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ADAQ | BODY LENGTH0 870 INCHES MAXIMUM |
MEMORY | ADAT | BODY WIDTH0 240 INCHES MINIMUM AND 0 260 INCHES MAXIMUM |
MEMORY | ADAU | BODY HEIGHT0 180 INCHES MAXIMUM |
MEMORY | AFGA | OPERATING TEMP RANGE-40 085 0 DEG CELSIUS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
MEMORY | CBBL | FEATURES PROVIDEDLOW POWER AND WCLOCK AND WINHIBIT AND WPRESET |
MEMORY | CQSJ | INCLOSURE MATERIALPLASTIC |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CQWX | OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN9 INPUT |
MEMORY | CRHL | BIT QUANTITY4 |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC18 0 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZEQ | TIME RATING PER CHACTERISTIC1100 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT AND 1100 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME HIGH TO LOW LEVEL OUTPUT |
MEMORY | CZER | MEMORY DEVICE TYPEROM |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT |
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